JPS6362918B2 - - Google Patents
Info
- Publication number
- JPS6362918B2 JPS6362918B2 JP56184894A JP18489481A JPS6362918B2 JP S6362918 B2 JPS6362918 B2 JP S6362918B2 JP 56184894 A JP56184894 A JP 56184894A JP 18489481 A JP18489481 A JP 18489481A JP S6362918 B2 JPS6362918 B2 JP S6362918B2
- Authority
- JP
- Japan
- Prior art keywords
- film substrate
- film
- etching
- pattern
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56184894A JPS5885590A (ja) | 1981-11-17 | 1981-11-17 | フイルム基板構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56184894A JPS5885590A (ja) | 1981-11-17 | 1981-11-17 | フイルム基板構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5885590A JPS5885590A (ja) | 1983-05-21 |
| JPS6362918B2 true JPS6362918B2 (en]) | 1988-12-05 |
Family
ID=16161175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56184894A Granted JPS5885590A (ja) | 1981-11-17 | 1981-11-17 | フイルム基板構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885590A (en]) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513376A (en]) * | 1974-06-29 | 1976-01-12 | Ebara Infilco | |
| JPS51145857A (en) * | 1975-06-11 | 1976-12-15 | Citizen Watch Co Ltd | Timekeeper substrate |
| JPS558777A (en) * | 1978-07-06 | 1980-01-22 | Terada Keori Kk | Preparation of lap blanket |
| JPS5553477A (en) * | 1978-10-13 | 1980-04-18 | Matsushita Electric Ind Co Ltd | Electronic circuit device and method of manufacturing same |
-
1981
- 1981-11-17 JP JP56184894A patent/JPS5885590A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5885590A (ja) | 1983-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5683566A (en) | Method of manufacting an SMD resistor | |
| US4621278A (en) | Composite film, semiconductor device employing the same and method of manufacturing | |
| US5119272A (en) | Circuit board and method of producing circuit board | |
| US4925522A (en) | Printed circuit assembly with contact dot | |
| JPS6362918B2 (en]) | ||
| JPS58159361A (ja) | 多層混成集積回路装置 | |
| JPS6256656B2 (en]) | ||
| US20070119911A1 (en) | Method of forming a composite standoff on a circuit board | |
| JP3523418B2 (ja) | 配線基板 | |
| JPS6347157B2 (en]) | ||
| JP4306892B2 (ja) | 回路保護素子の製造方法 | |
| GB2093401A (en) | Composite film | |
| JP2006216735A (ja) | 電子部品実装基板 | |
| JPS6220694B2 (en]) | ||
| JPH0249651Y2 (en]) | ||
| KR850001541B1 (ko) | 양면 프린트 기관과 그 다량 접속방법 | |
| JPS6155247B2 (en]) | ||
| JPH0519974Y2 (en]) | ||
| JPS6217858B2 (en]) | ||
| JPH0442938Y2 (en]) | ||
| JPS6217859B2 (en]) | ||
| JPH07240302A (ja) | チップ状電子部品とその製造方法 | |
| JPS6152977B2 (en]) | ||
| JP2014204094A (ja) | 抵抗器および抵抗器の製造方法 | |
| JPH0423321Y2 (en]) |